EM Modeling Intern: High-Speed Interconnects & SI/PI

Intel seeks an Engineer Intern in Guadalajara to support readiness and scalability for high-speed interconnects. You will develop 3D EM models using HFSS, CST, and ADS to support SI/PI evaluations, under mentorship across our I/O community.

You will run parametric studies, assist with validation against lab measurements, and help create reusable modeling workflows and guidelines for design teams, while learning best-practices in EM extraction.