Die Bond Process Engineer – Optoelectronics & Yield

ACCTON TECHNOLOGY SG PTE. LTD. in Singapore is looking for a Die Bond Process Engineer to develop and optimize die attach processes for optical transceiver manufacturing. The role requires strong technical skills in die bonding and process improvement with a focus on achieving production targets.

Candidates should have over 5 years of hands-on experience in semiconductor packaging, a bachelor's degree in relevant engineering fields, and strong analytical skills. Key responsibilities include process optimization, monitoring yield and quality metrics, and collaboration across teams.