Cmos Packaging & High-Speed Interconnect Engineer

Global Connect Technologies is looking for a Senior Engineer to specialize in CMOS and Metallization Test Structure Design and Layout.The role encompasses designing flip-chip BGA packages while ensuring signal and power integrity.The ideal candidate will have at least 8 years of relevant experience along with proficiency in Cadence APD.The position is full-time, suited for mid-senior level professionals.
#J-*****-Ljbffr