Chip-Package Strategy Director for Next-Gen Memory

Micron Semiconductor Asia Operations Pte. Ltd. is seeking an accomplished Director / DMTS for Package Development Engineering in Singapore. This role focuses on defining chip-package interaction technology and driving innovation in semiconductor memory products.

The ideal candidate will have over 15 years of experience in semiconductor technology and a strong background in technical leadership. Key responsibilities include collaborating with engineering teams globally and managing risk within complex design landscapes.

The role requires excellent communication skills and the ability to influence stakeholders and lead cross-disciplinary programs.