Assembly Process Engineer (Pop & Underfill) (Hermosillo)

KEENFINITY is a global provider of security and communication solutions with a commitment to innovation and quality.
We are seeking a highly skilled Assembly Process Engineer to drive advanced SMT manufacturing processes at our Hermosillo site.
Mission
Lead the development, optimization, and scaling of complex assembly solutions for high‐density electronic products, ensuring precision, reliability, and process excellence.
Responsibilities
Po P Process Development
Develop and maintain flux/paste dipping processes, optimizing transfer height and consistency.
Fine‐tune high‐precision placement parameters (X, Y, θ) to ensure accurate top‐package alignment.
Analyze and mitigate component warpage during reflow to prevent Hi P or open joint defects.
Underfill & Encapsulation
Optimize dispensing parameters (needle selection, pressure, speed) for CUF or jetting processes.
Improve flow dynamics, ensuring full coverage with zero voids or overflow.