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Assembly Media and Collaterals Development Engineer

Intel Corporation

kulim, kedah, Malaysia Full-time July 18, 2026

Found Description

Job Overview

Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

Responsibilities

  • Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
  • Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
  • Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral qu...

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