I

Assembly Media and Collaterals Development Engineer

Intel

kulim, kedah, Malaysia Full-time July 21, 2026

Found Description

Responsibilities

  • Develop media and collaterals for assembly processes and/or equipment, applying novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
  • Optimize and improve the efficiency of manufacturing media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Develop media and collateral specifications applying principles for design of experiments and data analysis, and document improvements through white papers.
  • Develop and maintain equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
  • Develop new techniques and acceleration methods, tools and quality screens to ensure early identification of potential problems with media and collateral quality and reliability.

Ready to Apply?

Submit your application for Assembly Media and Collaterals Development Engineer at Intel

Apply Now