Asic Package Design Engineer - High-Speed Serdes & Power

Link-Worldwide in Mexico, Sonora is seeking a skilled engineer to design complex flip-chip-BGA packages aimed at high-speed SerDes and high-power delivery.
The role involves collaboration with a global R&D team to create high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations.
Key responsibilities include analyzing chip requirements, assigning pins, and ensuring package-level signal and power integrity.
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