ASIC Package Design Engineer - High-Speed SerDes & Power

Link-Worldwide in Mexico, Sonora is seeking a skilled engineer to design complex flip-chip-BGA packages aimed at high-speed SerDes and high-power delivery. The role involves collaboration with a global R&D team to create high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations.

Key responsibilities include analyzing chip requirements, assigning pins, and ensuring package-level signal and power integrity.