Found Description
Link-Worldwide is seeking a specialized engineer to design complex flip-chip-BGA packages tailored for high-speed applications like AI, networking, and 5G.
Your role will involve collaboration with a global R&D team to ensure efficient package designs based on thorough chip analysis and integrity considerations.The ideal candidate will possess a solid background in package design, focusing on critical structures to support SerDes and high-power delivery.
This position offers opportunities for innovative contributions to cutting-edge technologies.
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