Found Description
Design complex flip-chip-BGA packages for high-speed SerDes and high-power delivery needs.Collaborate with the worldwide R&D team to develop high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations.Determine the necessary package type by analyzing the chip.Assign pins and layout critical structures for SerDes, ADC/DAC, DDR, etc.Apply knowledge of package-level signal integrity and power integrity to package designs.Work closely with signal integrity and power integrity partners to gather requirements and de-risk engineering issues.Route and develop structures, manage critical signal and power integrity tasks.