Advanced Semiconductor Packaging Process Engineer

Tampereen Yliopisto is looking for up to three Process Engineers specializing in semiconductor packaging processes in Tampere, Finland. This role involves developing processes like flip-chip bonding, dicing, and grinding, contributing to customer projects across academia and industry.

Ideal candidates hold an M.Sc. or Ph.D. in relevant fields with at least three years of experience. Successful applicants will enjoy competitive benefits including flexible work schedules and occupational healthcare services.