Found Description
Key Responsibilities
Process Integration & Architecture
- Architect and integrate post-FAB assembly flows , ensuring seamless transition from wafer fabrication to package-level execution
- Define and standardize Manufacturing Test Specifications (MTS) and Process Reference Plans (PRP)
- Drive cross-functional alignment across design, process, reliability, and manufacturing teams
Advanced Packaging Development
- Lead development and commercialization of 2.5D/3D/3.5D packaging platforms , including heterogeneous multi-die integration
- Enable system-level integration across chiplets, interposers, and advanced substrates
- Translate product requirements into scalable packaging architectures
Performance, Reliability & Failure Analysis
- Own electrical, thermal, and mechanical performance characterization
- Lead re...
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