Advanced Packaging Engineer Role at AMD

Drive innovation in 3D IC design at AMD, located in Markham, Ontario. Your expertise will help automate and advance CAD tools leveraging AI for design improvement and efficiency.Join the global 3D-IC Design and SoC Construction team, where you'll partner with cross-continent design teams. Your role will center on developing and integrating machine learning capabilities into existing CAD flows. Ideal candidates should possess a background in silicon hardware design, software experience, and a passion for enhancing design quality through automation.Key Responsibilities:
• Maintain 3D-IC and advanced packaging design from RTL through signoff
• Develop end-to-end AI solutions for CAD environments
• Automate design and verification using intelligent systems
• Collaborate with EDA companies on future innovations
• Analyze methodologies to improve quality of resultsRequirements:
• Extensive experience in advanced packaging and 3D-IC design
• Hands-on knowledge of key EDA ...