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Advance Packaging Technology Development Engineer (San Pedro Tlaquepaque)

Link-Worldwide

región centro, jalisco, Mexico Full-time June 11, 2026

Found Description

Advance Packaging Technology Development Engineer (ATPDE)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Requirements

  • Experience: More than 7 years experience in semiconductor manufacturing or a related field, with hands‑on experience in Semiconductor Packaging or Fab Frontend processes. Experience with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.
  • Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. PhD/ Masters Degree is preferred.
  • Technical Experience: Development experience in one or more areas of Photo, PVD, CVD, CMP, ...

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