3D IC and ADVANCED PACKAGING CAD ENGINEER

Overview

At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. We ground our work in a culture of innovation and collaboration, believing real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary.

The Role

The 3D‑IC Design and SoC Construction CAD team delivers automated environments for industry‑leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high‑performance bus implementation, and timing budgeting. We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework, increasingly embedding AI‑driven capabilities at every stage of the stack, from silicon to system.

This role is part of a global team working in concert with d...